The host of an all-in-one machine is usually located behind the screen, and its cooling fan is mostly on the top of the all-in-one machine to dissipate heat upwards and outwards. This design is not only for the sake of humanization, but also to avoid hot air blowing onto the desktop and reflecting, which affects the user's experience. It fully utilizes the principle of aerodynamics to suck in cold air at the bottom of the host. After being heated, the air naturally rises and is discharged by the top exhaust fan, achieving twice the result with half the effort in heat dissipation.
The principle of aerodynamic assisted heat dissipation is simple, but why do some all-in-one machines adopt a fan dispersed design for multiple "exhausts"? For example, the Apple iMac adopts a dispersed heat dissipation design, with heat sinks and fans placed near the main heating components to "exhaust" them nearby. This design can greatly shorten the length of the heat pipe, so that the heat from the main heating components can be promptly conducted to the heat exchanger and quickly discharged by the cooling fan. This reduces the thermal resistance of the heat pipe, which prevents the rapid transfer of heat from the main heating components, resulting in temperature rise and decreased stability. Especially suitable for high-performance and high-power models. But this design has mixed feelings. If the design skills are not enough, in order to set up the heat sink and fan nearby, the fan and heat sink are often placed at the bottom of the all-in-one machine. In this way, its heat is difficult to quickly dissipate outside the machine, and the hot air will heat other components inside the machine, causing the overall temperature of the machine to rise.