Mini PC CPU Heat Sink
Your Professional Mini PC CPU Heat Sink Supplier
Dongguan Solte Electronics Technology Co., Ltd. is a professional radiator design, development, production and sales company. The company's product lines mainly include: radiators for display devices (Monitor, TV, computer all-in-one), radiators for computers (CPU, GPU), projector radiators for projectors, radiators for servers, radiators for IGBT, etc.
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Mini Computer Heat Sink for CPU DevicesMini computers, due to their compact size, often face challenges related to heat dissipation, especially for CPU devices.read more
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Black Anodized Aluminum Heat Sink for CPUA black anodized aluminum heat sink for a CPU is a common cooling solution used to dissipate heat generated by the processor.read more
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CPU Heat Sink with Fin for Thermoelectric CoolingA TEC is a solid-state device that uses the Peltier effect to create a temperature difference by transferring heat from one side of the device to the other when an electric current is applied. One...read more
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CPU Cooling Fan with HeatsinkA CPU cooling fan with a heatsink is a crucial component in a computer system designed to manage and dissipate the heat generated by the CPU (Central Processing Unit).read more
Why Choose Us
Global Supply Chain
Our CPU fan coolers have been successfully exported to various regions, including Africa, North America, South America, the European Union, the Middle East, and Southeast Asia. With excellent quality and highly competitive pricing, our products have gained significant recognition in international markets.
Rich Experience
Coolsolte is one of the leading manufacturers of custom radiators in China, offering custom aluminum radiators and copper radiators, with more than 10 years of experience in the radiator industry.
OEM and ODM Services
The company possesses robust design and production capabilities, enabling it to provide customers with comprehensive OEM (Original Equipment Manufacturing) and ODM (Original Design Manufacturing) services.
Parameter
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Product Number |
STH-1295 |
|
Cpu Socket |
LGA1700X series |
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Product Size |
101.5*92*28.2mm |
|
Radiator Material |
Aluminum |
|
Fan Size |
9010 |
|
Rated Voltage |
12V |
|
Bearing Type |
Round frame fan |
|
Fan Speed |
4000RPM |
|
Fan Interface |
4PIN |
|
TDP |
95W |
Benefits of Mini PC CPU Heat Sink

Efficient Heat Dissipation
Aluminum's thermal conductivity helps transfer heat away from the CPU quickly.

Durability
The anodized layer protects against scratches and oxidation.

Aesthetic Appeal
The black finish complements modern PC builds, especially in gaming or high-performance setups.

Lightweight
Aluminum is lighter than copper, making it easier to handle and install.
The Operational Mechanism of Mini PC CPU Heat Sink
The source generates heat.
This source may be any system that creates heat and requires the removal of said heat to function correctly, such as:
- Mechanical
- Electrical
- Chemical
- Nuclear
- Solar
- Friction
Heat transfers away from the source
Heat pipes can also aid in this process, but we'll cover those components separately. In direct heat sink-contact applications, heat moves into the heat sink and away from the source via natural conduction. The heat sink material's thermal conductivity directly impacts this process. That's why high thermal conductivity materials such as copper and aluminum are most common in the construction of heat sinks.
Heat distributes throughout the heat sink
Heat will naturally travel through the heat sink via natural conduction moving across the thermal gradient from a high temperature to a low-temperature environment. This ultimately means that the heat sink's thermal profile will not be consistent. As such, heat sinks will often be hotter towards the source and cooler towards the sink's extremities.
Heat moves away from the heat sink
This process relies on the heat sink's temperature gradient and its working fluid―most commonly air or a non-electrically-conductive liquid. The working fluid passes across the surface of the warm heat sink and utilizes thermal diffusion and convection to remove heat away from the surface and into the ambient environment. This stage relies on, yet again, a temperature gradient to remove heat from the heat sink. Therefore, if the ambient temperature is not cooler than the heat sink, no convection and subsequent heat removal will occur. This step is also where the total surface area of the heat sink becomes most advantageous. A large surface area provides an increased area for thermal diffusion and convection to occur.
Important Considerations
Heat Sink Capacity
The heat sink must handle both the CPU's heat and the heat generated by the TEC.
Condensation Management
Use insulation and a humidity sensor to prevent condensation from damaging components.
Power Requirements
Ensure your power supply can handle the additional load from the TEC.
Logistics
We will help you to choose the best shipping way according to your detail requirements. By sea, by air, or by express, etc.
The time frame of an order delivery is divided into two parts
Processing time: 7-14 Days
Shipping time: 20~30 Days
Shipping methods
DDP, DAP, EXW, etc.
Shipping fee
The shipping fee will be changed according to every pacel's weight.
FAQ
We're professional mini pc CPU heat sink manufacturers and suppliers in China, specialized in providing high quality customized service. We warmly welcome you to buy mini pc CPU heat sink for sale here from our factory. Contact us for quotation.
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